SINGAPORE, Dec. 24, 2019 /PRNewswire/ -- JCET Group Co., Ltd ('JCET') has entered into a strategic business agreement with Analog Devices Inc. ('ADI') in which JCET will acquire ADI's test facility in Singapore. As part of this agreement, JCET will take on additional ADI test business in this newly acquired facility. The final transfer of ownership of the ADI Singapore test facility to JCET will be completed May 2021.
"This agreement with our long-time assembly and test partner JCET will allow ADI to take advantage of the operational and test engineering expertise we have experienced for many years as a customer in their Singapore plant," stated Steve Lattari, Senior Vice President of Global Operations and Technology at ADI. "We anticipate a smooth transition as we work together to make this new part of our relationship happen," continued Lattari.
"ADI has been a highly valued and long-standing customer of JCET. This opportunity to both grow our test floor footprint in Singapore and more importantly our business with ADI is a win-win for our companies," stated Li Zheng, CEO of JCET Group. "JCET's investment in this Singapore facility also shows that as a multinational semiconductor company, we will continue to steadily strengthen our global expansion and provide first-class integrated circuit products and advanced technical services to international and local customers," continued Mr. Zheng.
JCET Group has six factories located in China, Singapore and Korea. Its Singapore facility was established in 1994 as the first Outsourced Semiconductor Assembly and Test (OSAT) provider in Singapore. JCET Singapore's test services include wafer sort, final package test, strip test, wafer bump and all wafer level products.
Founded in 1972, JCET Group Co., Ltd. ("JCET") is one of the top semiconductor packaging and test providers in the world and the largest provider in China. With full turnkey services encompassing design and characterization, wafer bump, packaging and test, JCET is a strategic partner for semiconductor companies across a broad range of markets and applications. The comprehensive packaging portfolio of JCET and its subsidiaries include discrete, leaded, laminate, flip chip, Molded Interconnect System, wafer level packaging and System-in-Package technologies. Headquartered in Jiangyin, Jiangsu, China, JCET has an extensive global manufacturing base with operations in China, Singapore and South Korea. JCET is a publicly-traded company that is listed on the Shanghai Stock Exchange. Further information is available at www.jcetglobal.com [http://www.jcetglobal.com/].
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Web site: http://www.jcetglobal.com/