HSINCHU, Taiwan, Sept. 20, 2018 /PRNewswire/ -- Amid over demand from power management components (MOSFET) in booming smart car markets, and addressing the heavy shortage of this segment in supply chain, iST, the leader in semiconductor verification and analysis fields has recently offered MOSFET wafer backend process integrated service. The wafer thinning - Backside Grinding / Backside Metallization (BGBM) process has begun mass production with steady order release to a handful of customers this month. The yield rate has been continuously improving for two consecutive months to 99.5% currently.
To assist customers in one-stop integration to the BGBM process, iST's Front-side Metallization Process (FSM) is offering Chemical / Electro-less Plating service on top of Sputtering Deposition beginning this month. The post-installation test was successful and small scale mass production is underway for customers.
According to iST, it is one of the very few service providers capable of offering a full range of service covering both Chemical Plating and Sputtering Deposition FSM processes along with BGBM.
Thanks to its reliable quality, Sputtering Deposition has been the ideal FSM process, and is widely adopted by automotive and industrial electronics brands pursuing high quality. iST is now certified by multiple global brands and running with steady production.
In spite of most automotive and industrial electronics brands' preference of Sputtering Deposition over FSM, more industries, including upmarket PCs, servers, and consumer electronics, are looking forward to the highly cost-effective Chemical Plating for FSM.
iST said, "Sputtering Deposition and Chemical Plating now accounts for roughly the same 50% share of market demand with Chemical Plating slightly edging out Sputtering Deposition due to the former's high cost-effect ratio. iST is confident that the undersupply of Chemical Plating now on the market will be improved after its launch of Chemical Plating this month."
iST further noted that combining the Chemical Plating production line with the existing Sputtering Deposition and BGBM ones, as well as connecting it with DPS (Die Package Service) by ITS, and backend test production line is enabling iST to complete the entire process in iST's Plant 2. With this service by iST, our clients may receive products in the form of die directly without risking damage caused by transporting wafers among individual service providers.
Contact Window: Mr. Tony Liu Director of Surface Process Engineering Division Tel: +886-3-5799909-Ext.5001 Email: web_SP@istgroup.com [mailto:web_SP@istgroup.com] / firstname.lastname@example.org [mailto:email@example.com]